W2L14C334MAT1A [KYOCERA AVX]
Ceramic Capacitor, Multilayer, Ceramic, 4V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.33uF, Surface Mount, 0508, CHIP, ROHS COMPLIANT;
| 型号： | W2L14C334MAT1A |
| 厂家： | 
KYOCERA AVX |
| 描述： | Ceramic Capacitor, Multilayer, Ceramic, 4V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.33uF, Surface Mount, 0508, CHIP, ROHS COMPLIANT 电容器 |
| 文件： | 总2页 (文件大小：118K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IDC Low Inductance Capacitors (RoHS)
0306/0612/0508 IDC (InterDigitated Capacitors)
GENERAL DESCRIPTION
Inter-Digitated Capacitors (IDCs) are used for both semiconductor
package and board level decoupling. The equivalent series
inductance (ESL) of a single capacitor or an array of capacitors in
0612
parallel determines the response time of a Power Delivery Network
(PDN). The lower the ESL of a PDN, the faster the response time.
A designer can use many standard MLCCs in parallel to reduce
ESL or a low ESL Inter-Digitated Capacitor (IDC) device. These IDC
devices are available in versions with a maximum height of 0.95mm
+
–
+
–
or 0.55mm.
0508
IDCs are typically used on packages of semiconductor products
with power levels of 15 watts or greater. Inter-Digitated Capacitors
are used on CPU, GPU, ASIC, and ASSP devices produced on
0.13μ, 90nm, 65nm, and 45nm processes. IDC devices are used
on both ceramic and organic package substrates. These low ESL
surface mount capacitors can be placed on the bottom side or the
top side of a package substrate. The low profile 0.55mm maximum
height IDCs can easily be used on the bottom side of BGA
packages or on the die side of packages under a heat spreader.
+
–
+
–
0306
TYPICAL IMPEDANCE
10
IDCs are used for board level decoupling of systems with speeds of
300MHz or greater. Low ESL IDCs free up valuable board space by
reducing the number of capacitors required versus standard
MLCCs. There are additional benefits to reducing the number of
capacitors beyond saving board space including higher reliability
from a reduction in the number of components and lower
placement costs based on the need for fewer capacitors.
MLCC_1206
LICC_0612
1
0.1
IDC_0612
0.01
The Inter-Digitated Capacitor (IDC) technology was developed by
AVX. This is the second family of Low Inductance MLCC products
created by AVX. IDCs are a cost effective alternative to AVX’s first
generation low ESL family for high-reliability applications known as
LICA (Low Inductance Chip Array).
0.001
1
10
100
1000
Frequency (MHz)
AVX IDC products are available with a lead-free finish of plated
Nickel/Tin.
HOW TO ORDER
225
M
W
3
L
1
6
D
A
T
3
A
Capacitance Capacitance
Style
IDC
Low
Inductance
Number Voltage Dielectric
Failure Termination Packaging
Thickness
Max. Thickness
mm (in.)
A=Standard
S=0.55 (0.0±±)
Code (In pF)
Tolerance
Case
of
Rate
4 = 4V
C = X7R
D = X5R
Z = X7S
T = Plated Ni
and Sn
Available
1=7" Reel
3=13" Reel
Size
Terminals
1 = 8 Terminals
± Sig. Digits + M = ±±0ꢀ
Number of
Zeros
A = N/A
6 = 6.3V
Z = 10V
Y = 16V
3 = ±5V
± = 0508
3 = 061±
4 = 0306
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
PERFORMANCE CHARACTERISTICS
Capacitance Tolerance
Operation
±±0ꢀ Preferred
Dielectric Strength
CTE (ppm/C)
No problems observed after ±.5 x RVDC
for 5 seconds at 50mA max current
X7R = -55°C to +1±5°C
X5R = -55°C to +85°C
X7S = -55°C to +1±5°C
Temperature Range
1±.0
Thermal Conductivity 4-5W/M K
Temperature Coefficient ±15ꢀ (0VDC), ±±±ꢀ (X7S)
Voltage Ratings
4, 6.3, 10, 16, ±5 VDC
Terminations
Available
Plated Nickel and Solder
Dissipation Factor
≤ 6.3V = 6.5ꢀ max;
10V = 5.0ꢀ max;
≥ 16V = 3.5ꢀ max
Insulation Resistance
(@+25°C, RVDC)
100,000MΩ min, or 1,000MΩ per
μF min.,whichever is less
REV 01
78
IDC Low Inductance Capacitors (RoHS)
0306/0612/0508 IDC (InterDigitated Capacitors)
SIZE
W4 = 0306
W2 = Thin 0508
W2 = 0508
W3= Thin 0612
W3 = 0612
W3 = THICK 0612
Max.
mm
(in.)
0.55
0.55.
0.95
0.55
0.95
1.±±
Thickness
(0.0±±)
(0.0±±)
(0.037)
(0.0±±)
(0.037)
(0.048)
WVDC
4
6.3
4
6.3
10
16
±5
4
6.3
10
16
±5
4
6.3
10
16
4
6.3
10
16
±5
4
6.3
10
16
Cap
(μF)
0.010
0.0±±
0.033
0.047
0.068
0.10
0.±±
0.33
0.47
0.68
1.0
1.5
±.±
3.3
Consult factory for
additional requirements
PHYSICAL DIMENSIONS AND PAD LAYOUT
W
= X7R
= X5R
= X7S
P
E
T
D
BW
A
B
C
BL
L
PAD LAYOUT
DIMENSIONS
PHYSICAL CHIP DIMENSIONS millimeters (inches)
SIZE
0306
W
L
BW
0.±5 ± 0.10
BL
0.±0 ± 0.10
P
SIZE
0306
A
0.38
B
0.89
C
1.±7
D
0.±0
E
0.40
1.60 ± 0.±0
0.8± ± 0.10
0.40 ± 0.05
(0.015 ± 0.00±)
(0.063 ± 0.008) (0.03± ± 0.006 (0.010 ± 0.004) (0.008± 0.004)
±.03 ± 0.±0 1.±7 ± 0.±0 0.30 ± 0.10 0.±5 ± 0.15
(0.080 ± 0.008) (0.050 ± 0.008) (0.01± ± 0.004) (0.010± 0.006)
3.±0 ± 0.±0 1.60 ± 0.±0 0.50 ± 0.10 0.±5 ± 0.15
(0.015) (0.035) (0.050) (0.008) (0.015)
0.64 1.±7 1.91 0.±8 0.50
(0.0±5) (0.050) (0.075) (0.011) (0.0±0)
0.89 1.65 ±.54 0.45 0.80
(0.035) (0.065) (0.010) (0.018) (0.031)
0.50 ± 0.05
(0.0±0 ± 0.00±)
0508
0612
0508
0612
0.80 ± 0.10
(0.1±6 ± 0.008) (0.063 ± 0.008) (0.0±0 ± 0.004) (0.010 ± 0.006) (0.031 ± 0.004)
REV 01
79
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